![]() At this step there is still no solder joint on the bottom. After that you should place all components on PCB and reflow that. ![]() ![]() After reflow you turn PCB around and then aplly glue points on the PCB at the places, where components will be placed. After you can solder selective THT components.Īs in previous post mentioned you apply paste on top of the board and then also place SMT components. For that you also have to adjust temperature profile on reflow owen. That SMT components are not displaced on PCB you can use two different solder pastes with diferent melting points. You shouldn't put any heavy components on this side( 0805, 1206, so8. You can first apply solder paste on let say top side of PCB, then you place SMT components and reflow that. The solder mask for the comp and the assembly descriptions of the pcb. You also must have a best known on make gerber files and also The ability of your pcb soldering manufatuer technology. They are a lot of rules how to put the comp for exaple you have a minĭistance from a bga and other comp. The reflow for the bottom side also, and the connectors solderred If you have smt chips on the top and bottom side you must use The Reflow method is the newest it popular in smt sordering, Soldering wave can attack the pads olnly from one way. That is a sigle way to put the comp on the board because the To not make "shadows" of tin when you are soldering. The components must be place in same directions attempts You can't use that method for big ic's (smt, and of corse not bga). Some small ic's that can be solder in that way. With the the was added the smt tech for smt passive comp and also Use is for thru hole componnet(old chips,cap,connectors). It popular for the PS side of the pcb(downd side) and the most Check on web.ĭo not hesitate to contact me for any aditional info!įirst the wave soldering is the old and first method for soldering, Here is one manual for desining SMT PCB's:įor SMT stencil design you need aditional rules. The manufacturing friendly design is with SMD and THT components on top. I advise you that you should use reflow soldering for aplying SMT fine pitch components, because otherwise you can have problems with short circuits or missing solder on pads. For them we use wave soldering ( perhapse selectiv soldering with special frames or selective soldering machines ). Since now is trend in use of SMD, we have some compoents wich are still THT( conectors mostly.). Vawe soldering we use mostly for THT components soldering. I see that this is wery interesting thematics, so I'll try to help a litlle.
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